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Commencing January 2018, Prof Patrick McNally has been appointed Deputy Editor-in-Chief of Journal of Materials Science: Materials in Electronics. Published by Springer, with an impact factor ca. 2.0, JMSE is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics covering the ground between the fundamental science, such as semiconductor physics, and work concerned solely with applications. It features not only the growth and preparation of new materials, but also their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterisation related to the whole range of applications in electronics.
Further details are available at www.springeronline.com/journal/10854

I-FORM ADDITIVE MANUFACTURING RESEARCH CENTRE. Science Foundation Ireland
announced (May 2017) the funding of four new SFI Research Centres including the "Innovative techniques and processes in Additive Manufacturing" centre, called I-Form.  NPL researchers have been funded under I-Form, and will provide novel non-destructive radio frequency, x-ray and photoacoustic metrologies for additive manufacturing process quality monitoring. Prof Patrick McNally will be working with the I-Form Deputy Director, Prof Dermot Brabazon of APT, on developing and validating these new technologies in a processing environment. More details on www.i-form.ie
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Exciting novel nondestructive x-ray diffraction imaging techniques have been pioneered by the Dublin-Durham-Freiburg research team led by Prof Patrick McNally of NPL and has been publicised as a Science Highlight by the Diamond Light Source in Oxfordshire (UK), one of Europe's largest and most advanced research facilities. Using the intense x-ray beams generated at Diamond, the team has developed a suite of techniques capable of accurately, precisely and verifiably measuring the stress and warpage in silicon die inside fully encapsulated advanced chip packages. These packages are under development for next generation integrated circuit deployment and the work points the way to a new industry based quality assurance technique.  Further details are available on
www.diamond.ac.uk/Science/Research/Highlights/2017/warped-microchips.html

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Enterprise Ireland has recently awarded a Commercialisation Fund Award to NPL for the 30 month development of novel technology for radio frequency monitoring of commercial plasma processing systems. The project is entitled "Non-invasive Monitoring Probes for Industrial Plasmas (NiMPIP)" and builds on earlier Enterprise Ireland support via their Commercial Case Feasibility programme.

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Dr Stephen Daniels of NPL was awarded a Health Research Board & Science Foundation Ireland research grant under the Translational Research Awards programme. This project is entitled "Improved Methods to Detect and Decontaminate Environmental Sources of Healthcare-Associated Infection" and runs in collaboration with Professor Hilary Humphreys in RCSI/Beaumont Hospital, Dublin.

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patrick  mcnally

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Prof. Patrick McNally, BE, ScM, PhD, FIEI, FInstP,CEng, CPhys, SMIEEE.

Contact:
patrick(dot)mcnally(at)dcu(dot)ie

Prof. Patrick McNally received a BE (First Class Hons.) degree from University College, Galway, Ireland, and the degrees of ScM and PhD from Brown University, Rhode Island, USA in 1988 and 1992, respectively.

He is a  Professor in the School of Electronic Engineering at Dublin City University, where he served as Head of School (2012-2015). He has more than 25 years’ experience in non-invasive non-destructive metrology techniques.

He is Associate Editor-in-Chief of Journal of Materials Science: Materials in Electronics. He has authored or co-authored more than 300 scientific papers, holds two patents and has five pending.

In 2010 he was a founder and CTO of Sonex Metrology Ltd., a company offering photoacoustics metrology solutions for the semiconductor IC and packaging markets.

Prof. McNally’s main research interests include nanomaterials and electronic device process characterisation (including x-ray diffraction imaging and photoacoustic metrology), portable photoacoustics systems for 
bio-detection, and copper halides for photonics applications.


Full details of publications etc. at
https://www.researchgate.net/profile/Patrick_Mcnally2
https://dcu.academia.edu/PatrickMcNally
https://ie.linkedin.com/pub/patrick-mcnally/34/3b/70


stephen daniels (currently on Leave of absence)

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Dr. Stephen Daniels, BEng, PhD, MIEEE.

Contact:
stephen(dot)daniels(at)dcu(dot)ie


Stephen is Director of DCU's Sustainable Economies and Societies Hub and is a Senior Lecturer in the School of Electronic Engineering. His primary scientific technical competence is in the area of integrated circuit manufacturing processes and novel thin film deposition techniques. He also has extensive experience in product design and development. He has spent time working at Philips Research, IMEC and the Applied Materials laboratories in California, and maintains significant national and international linkages within the broader plasma and semiconductor processing industry.


Stephen also directs DCU's Energy and Design Laboratory (EDL) in DCU. The EDL was established to facilitate fundamental and applied research in energy engineering, with a particular emphasis on the design, modelling, and analysis of sustainable energy systems and installations, and the design of energy efficient devices.

Full details of publications etc. at
http://energylab.eeng.dcu.ie
https://ie.linkedin.com/pub/stephen-daniels/4/58a/413

http://www.dcu.ie/research/people/stephen-daniels.shtml
http://daniels.eeng.dcu.ie/
News and Forthcoming Activities
Journal of Materials Science: Materials in Electronics Patrick McNally appointed as Eeitor of JMSE (2016- ). See www.springeronline.com/journal/10854

Recent Publications

  • "Remote sensing of a low pressure plasma in the radio near field" by S. Kelly and P.J. McNally, Appl. Phys. Express (2017) 10 096101. https://doi.org/10.7567/APEX.10.096101
  • "Nondestructive, in situ mapping of die surface displacements in encapsulated IC chip packages using x-ray diffraction imaging techniques", N.E. Gorji, B.K. Tanner, R.K Vijayaraghavan, A.N Danilewsky and and P.J. McNally, Proc. IEEE 67th Electronic Components and Technology Conference (ECTC 2017), https://doi.org/10.1109/ECTC.2017.175
  • “Nondestructive X-ray diffraction measurement of warpage in silicon dies embedded in integrated circuit packages”, B. K. Tanner, A. N. Danilewsky, R. K. Vijayaraghavan, A. Cowley and P. J. McNally, J. Appl. Cryst. 50, pp. 547–554 (2017). https://doi.org/10.1107/S1600576717003132
  •  "Pulsed-Plasma Physical Vapor Deposition Approach Toward the Facile Synthesis of Multilayer and Monolayer Graphene for Anticoagulation Applications", R.K. Vijayaraghavan, C. Gaman, B. Jose, A.P McCoy, T. Cafolla, P.J. McNally and S. Daniels, ACS Appl. Mater. Interfaces 8, pp. 4878−4886 (2016). DOI: 10.1021/acsami.5b10952
  • "Simultaneous depth-profiling of electrical and elemental properties of ion-implanted arsenic in silicon by combining secondary-ion mass spectrometry with resistivity measurements", N Bennett, C.S. Wong and P.J. McNally, Rev. Sci. Instrumen. 87,  074702 (2016).   
  • "Nondestructive monitoring of die warpage in encapsulated chip packages", A. Bose, R.K. Vijayaraghavan, A. Cowley, V. Cherman, O. Varela Pedreira, B.K. Tanner, A.N. Danilewsky, I. De Wolf and P.J. McNally, IEEE Trans. Comp. Packaging Manuf. Technol., 6, pp. 653-662 (2016). DOI: 10.1109/TCPMT.2016.2527060 (2016).   
ICOOPMA 2016 (7th International Conference on Optical, Optoelectronic and Photonic Materials and Applications), Montréal, Québec,Canada (12-17 June, 2016).
Prof. Patrick McNally delivered an invited talk entitled "X-ray diffraction imaging for real-time in situ monitoring of future 3-D photonics system packages".

FORTHCOMING CONFERENCES
ECTC 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, IDA (29 May-1 June, 2018).

MAM2018 (Materials for Advanced Metallization), Milan, Italy (18-21 March, 2018)

IEEE EuroSimE Conference 2018  (Thermal, Mechanical & Multiphysics Simulation and Experiments
in Micro/Nano-Electronics and Micro/Nano-systems), Toulouse, France (16-18 April, 2018)

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IEEE UK & Ireland Section
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commercialisation

Technology and IP developed by NPL researchers has led to the spin out of numerous start-ups.

These include:

www.sonex-metrology.com

www.qualflow.com
www.arannhealthcare.iewww.lexasresearch.com


For further details, please contact our INVENT Centre in DCU.